发明名称 METHOD FOR PROCESSING SUBSTRATE, DEVICE FOR PROCESSING SUBSTRATE AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a method and the like for processing a substrate such that drying preventing liquid entering a pattern on the substrate can be removed.SOLUTION: A substrate W, which has a surface with an irregular pattern formed thereon, and to which drying preventing liquid covering the pattern so as to enter recessed parts thereof adheres, is carried into a processing container 31; the substrate W is heated while pressurizing the interior of the processing container 31 so that the temperature-pressure state of the drying preventing liquid on the substrate W changes along the vapor pressure curve of the drying preventing liquid or through a region lying on the liquid phase side of the vapor pressure curve, and reaches a high-pressure state which is a supercritical state or a subcritical state, thereby bringing the drying preventing liquid into the high-pressure state while keeping the liquid in the recessed portions of the pattern; and thereafter, fluid in the processing container 31 is discharged in a high pressure state or in a gaseous state.
申请公布号 JP2013179245(A) 申请公布日期 2013.09.09
申请号 JP20120113563 申请日期 2012.05.17
申请人 TOSHIBA CORP;TOKYO ELECTRON LTD 发明人 HAYASHI HIDEKAZU;SATO YOHEI;OGUCHI HISASHI;TOMITA HIROSHI;MITSUOKA KAZUYUKI;YO HAJIME;ONO HIROMOTO;ORII TAKEHIKO;IWASHITA MITSUAKI;TOSHIMA TAKAYUKI
分类号 H01L21/304 主分类号 H01L21/304
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