| 摘要 |
PURPOSE: An integrated circuit device and a warpage controlling method are provided to flatten a surface for attaching the integrated circuit device to a heat sink by preventing the warpage of a base. CONSTITUTION: At least one die (502,504) is attached to a base (506). A counterbalancing layer (508) compensates for a part of a thermal expansion difference between the base and the die. The counterbalancing layer is deposited on one side of the base. The thickness of the counterbalancing layer is 5 to 100 micrometers. |
