Light emitting device package, assembly of printed circuit board and light emitting device package, and backlight unit comprising the same

摘要

PURPOSE: A light emitting device package, a printed circuit board light emitting device package assembly, and a backlight unit including the same are provided to efficiently prevent the deformation of a molding material due to heat by discharging heat from a light emitting device to the outside through holes of the molding material. CONSTITUTION: A lead frame(10) includes a first lead(11) and a second lead(12). The first lead includes a first surface and a second surface. The second lead includes a first surface and a second surface. A light emitting device(20) is arranged on the first surface of the first lead. A molding material(30) is combined with the lead frame to cover the second surface of the first lead. The molding material includes an opening(30a) to emit light from the light emitting device.