| 摘要 |
<p>The purpose of the present invention is to provide a photosensitive resin composition exhibiting excellent sensitivity, an excellent dielectric constant after curing, and excellent pattern resolution after baking. This photosensitive resin composition is characterized by containing (component A) a resin satisfying (1) or (2), (component B) a photoacid generator, (component C) a hollow particle, and (component D) a solvent. (1) (a1) An acrylic resin having at least a constitutional unit having a group in which an acid group is protected by an acid-decomposing group, and (a2) a constitutional unit having a cross-linking group. (2) (a1) An acrylic resin having a constitutional unit having a group in which an acid group is protected by an acid-decomposing group, and (a2) an acrylic resin having a constitutional unit having a cross-linking group.</p> |
