| 摘要 |
PURPOSE: An optical semiconductor based lighting device and a manufacturing method thereof are provided to form a metal laminated layer at a boundary between a printed circuit board and a heat-sink, thereby increasing heat performance. CONSTITUTION: A plurality of semiconductor optical devices(10) are mounted on top of a printed circuit board(20). A heat-sink(30) is combined on the bottom surface of the printed circuit board. A metal bond layer bonds the bottom surface of printed circuit board and the top of the heat sink. The printed circuit board includes a metalizing layer. The printed circuit board includes a non-metal substrate. |
