| 摘要 |
<p>Provided is a polyene-polythiol resin composition with outstanding heat resistance. A resin composition containing: (A) a silsesquioxane derivative represented by formula [1] below, having a random structure, and having two or more carbon-carbon unsaturated bonds per molecule; (B) a polythiol; and (C) a photoradical polymerization initiator. General formula [1] (R0-SiO3/2)m (in the formula, R0 has one or more functional groups selected from a (meth)acryloyl groups, a vinyl group, a vinyl ether group, an allyl group and an allyl ether group. R0 may be the same or different. Part of the (meth) acryloyl group, vinyl group, vinyl ether group, allyl group and allyl ether group may be substituted with a C1-6 alkyl group, a C1-6 alkoxy group, a C1-6 halogenated alkyl group, a phenyl group, or a halogen. m represents the degree of polymerisation.)</p> |
