METHOD FOR CUTTING SILICON INGOT

摘要

[Problem] To provide a method that is for cutting a silicon ingot and that, without using an abrasive grit, can efficiently cut a silicon ingot by means of a simple process, and that can cause a silicon wafer to become a thin film and to have reduced damage to the surface thereof. [Solution] In the method for cutting a silicon ingot, which cuts a silicon ingot by causing a metal wire (4) to travel while pressing against the silicon ingot (2) in the state of supplying etching liquid (6) to the metal wire (4), the metal wire is heated by means of electric heating.