| 摘要 |
<p>This optical module, which is used in an information processing device, is configured to include: a board having a wiring pattern formed on the surface thereof; a semiconductor device mounted on the wiring pattern of the board; a heat dissipating fin that is mounted on the semiconductor device and dissipates heat generated by the semiconductor device; a photoelectric conversion element that is mounted on the wiring pattern of the board and is electrically connected to the semiconductor device; a module connector, one surface of which is connected to the photoelectric conversion element; and an optical fiber or optical waveguide that is connected to the other surface of the module connector. The optical fiber or optical waveguide is configured in such a manner as to be connected to the module connector so as to extend in a direction that intersects with the direction in which the semiconductor device and the photoelectric conversion element are aligned on the board, enabling sending or receiving integrated circuits (ICs) and photoelectric conversion elements to be densely packed on each of a plurality of daughter boards connected to a backplane board.</p> |
