发明名称 ADHERING APPARATUS
摘要 <p>This adhering apparatus efficiently performs adhering operations by applying an adhesive to a film and adhering the film to a substrate in an integrated production line. The present invention relates to an adhering apparatus (100), which is provided with: a transfer unit (104), which transfers a film (60); an applying unit (106), which applies a coating solution (N) to the film; a cutter (48), which cuts the film at a predetermined length, said film having the coating solution applied thereto; and an adhering unit (105), which adheres the film to a substrate (1).</p>
申请公布号 WO2013129561(A1) 申请公布日期 2013.09.06
申请号 WO2013JP55370 申请日期 2013.02.28
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SHIMAI FUTOSHI;SATO AKIHIKO;MARUYAMA KENJI;HOSODA HIROSHI;CHIBA MASAKI
分类号 H01L21/683;B65C9/18;B65C9/22;B65H37/04 主分类号 H01L21/683
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