发明名称 HETEROJUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
摘要 <p>The present invention relates to a heterojunction structure and a method for manufacturing same, and more particularly to a heterojunction structure having precision cutting processability and superior thermal conductivity to minimize thermal stress at a heterojunction region, and a method for manufacturing same. To this end, the heterojunction structure includes: a first part including ceramic; and a second part including carbon and being junctioned to the first part by brazing.</p>
申请公布号 WO2013129891(A1) 申请公布日期 2013.09.06
申请号 WO2013KR01684 申请日期 2013.02.28
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 SHIN, SEUNG-YONG;SUN, JU-HYUN;LEE, CHANG-HUN
分类号 C04B35/80;C04B35/71;C04B41/52 主分类号 C04B35/80
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