| 摘要 |
The present invention is characterized in that, in the preparation of a plating solution comprising at least (1) a dialkyl sulfone, (2) an aluminum halide and (3) a nitrogenated compound, the dialkyl sulfone, the aluminum halide and the nitrogenated compound are compounded at such a ratio that the amount of the aluminum halide is 3.5+n to 4.2+n mole(s) and the amount of the nitrogenated compound is n mole(s) (wherein n is 0.001 to 2.0 moles) relative to 10 moles of the dialkyl sulfone. A plating solution for electrical aluminum plating, which is prepared by the method according to the present invention, enables an electrical plating treatment with high aluminum deposition efficiency relative to the amount of electricity supplied, and therefore enables the reduction in electricity usage and has the advantage of excellent economic efficiency. |
