METHOD FOR PREPARING A COMPLEX SUBSTRATE FILM AND BACKGRINDING TAPE FOR SEMICONDUCTOR WAFER COMPRISING A COMPLEX SUBSTRATE FILM PREPARED BY THE SAME

摘要

PURPOSE: A backgrinding tape comprising a complex substrate film is provided to prevent a semiconductor wafer from bending in the process of thickness reduction of the semiconductor wafer and to reduce peeling force, thereby preventing errors in a peeling process induced in the process of removing the backgrinding tape. CONSTITUTION: A method for preparing a complex substrate film comprises the steps of: providing a polyolefin film with a thickness of 50 to 200 um; forming an adhesive layer (4) by applying an adhesive composition on a surface of the polyolefin film; and combining the polyolefin film having the adhesive layer with a polyester film having a thickness of 10 to 50 um. The adhesive composition comprises 100 parts by weight of an acrylic copolymer, 1 to 5 parts by weight of a thermocurable isocyanate curing agent, and 10 to 30 parts by weight of a solvent.