| 摘要 |
<p>In the present invention, a plate-shaped interposer (53) is affixed to the bottom surface in a package (42). A plurality of acoustic sensors (43a, 43b) are affixed to the top surface of the interposer (53). A plurality of through holes (54, 54) that penetrate vertically are provided to the interposer (53), and the through holes (54, 54) respectively interconnect to the cavities (front chamber (52) of the acoustic sensors (43a, 43b). Also a sound hole (45) opens at the bottom surface of the package (42), and at least a portion of the sound hole (45) overlaps the through holes (54). As a result, the sound hole (45) is connected to the cavities of the acoustic sensors (43a, 43b) via the through holes (54). Also, the gap between the acoustic sensors (43a, 43b) is occluded by the interposer (53).</p> |
