| 摘要 |
A circuit board assembly is described. The assembly comprises a module (2) which comprises a first substrate (7) having first and second faces (8, 9), a first conductive region (11) disposed on the first face of the first substrate and a hole (14) in or adjacent to the first conductive region and passing through the first substrate between the first and second faces. The assembly also comprises a circuit board (3) which comprises a second substrate (4) having first and second faces (5), a second conductive region (6) disposed on the first face of the second substrate. Conductive ink (15) is disposed in the hole and between the first and second substrates. The module is mounted to the circuit board and is arranged such that the hole lies over or adjacent to the second conductive region and the conductive ink provides an electrical connection between first and second conductive regions. |
