| 摘要 |
PURPOSE: A test jig of a semiconductor package is provided to quickly process a large number of semiconductor packages by quickly and accurately measuring an electrical property of the semiconductor packages. CONSTITUTION: A main body (204) includes a support plate (202) and a plate (212) is installed on the top of the main body and includes a semiconductor package. An X-axis gradation hexagon rod (218) is movably included in the main body. AnY-axis gradation hexagon rod (226) is movably included in the main body. An X-axis rotation knob (244) is movably included in the main body. An X-axis rotation connection unit (246) is movably included in the main body and rotates along the X-axis rotation knob. An X-axis rotation connection unit (250) rotates along a Y-axis rotation knob (248). An X-axis sliding unit (252) is slid on a top surface of the support plate. A protruding extended unit (254) is extended and protruding from an end of the X-axis sliding unit. A Y-axis sliding unit (256) rotates along the rotation of the Y-axis rotation connection unit. A Y-axis gradation identifying unit (258) is extended and protruding from an end of the Y-axis sliding unit. A vertex unit (262) includes a combination hole (260). |
