METHOD FOR MANUFACTURING A DEVICE INCLUDING A MODULE PROVIDED WITH AN ELECTRIC AND/OR ELECTRONIC CIRCUIT

摘要

The invention relates to a method for manufacturing an electric and/or electronic device comprising or consisting of an electric and/or electronic circuit (27), said method including the steps according to which: the module is provided with at least one first circuit (28) arranged on or above a substrate (20) in a coating area (14E) partially occupying a surface of the substrate; said first circuit is at least partially coated with a protective material (14) in said coating area; and the module is provided with connection contacts (34) that are to permanently connect said first circuit to a second circuit (31) outside the module. The method is characterized in that it includes the step of creating connection contacts (34) in the coating area (14E) and above and vertically perpendicular to the connection holes (22). The invention also relates to a device corresponding to the method.