发明名称 |
METHOD OF PREVENTING SILVER TARNISHING |
摘要 |
<p>PURPOSE: A method for preventing silver from tarnishing is provided to electroplate indium metal on the silver, thereby preventing the silver from tarnishing using an efficient and eco-friendly method. CONSTITUTION: A method for preventing silver from tarnishing includes: a step of feeding a substrate having a silver layer; and a step of electroplating an indium layer adjacent to the silver layer in order to forming a composite on the substrate. The composite of indium and silver has a contact resistance which is below a 5 mOhm. The composite is not heated. The contact resistance is 1 to 5 mOhm. The thickness of the indium layer is 0.5 to 50 nm. The concentration of indium ions in an indium electroplating bath is 0.5 to 10 g/L.</p> |
申请公布号 |
KR20130099879(A) |
申请公布日期 |
2013.09.06 |
申请号 |
KR20130021310 |
申请日期 |
2013.02.27 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
FOYET ADOLPHE;ZHANG BEGLINGER WAN;TOBEN MICHAEL P.;GUEBEY JONAS |
分类号 |
C25D3/46;C25D21/12 |
主分类号 |
C25D3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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