HETEROSTRUCTURE FOR HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A hetero junction heat-release structure and a manufacturing method thereof are provided to facilitate minute cutting processing, to enhance thermal conductivity and to minimize thermal stress of the hetero junction by brazing-welding a first unit which includes ceramics with a second unit which includes carbons. CONSTITUTION: A hetero junction heat-release structure comprises a first unit (410) and a second unit (201). The first unit includes ceramics and a semiconductor chip (530) and wiring patterns (510) are arranged on the first unit. The second unit includes carbons and is brazing-welded with the first unit. The heat generated from the semiconductor chip or the wiring pattern is emitted to the outside. The second unit is a body part (112) composed of carbons or equipped with a hybrid complex which includes carbons. A manufacturing method of the hetero junction heat-release structure comprises the following steps: preparing the first unit which includes ceramics; forming the second unit which includes carbons; and brazing-welding the first unit and the second unit.