TEMPERATURE MEASURING DEVICE, HEAT TREATMENT DEVICE FOR WAFER AND METHOD OF HEAT TREATMENT OF WAFER

摘要

PURPOSE: A temperature measuring apparatus and an apparatus and method for thermally processing a wafer are provided to accurately measure the temperature of a thermal processing apparatus by arranging a temperature measuring unit in a groove formed on a support wafer. CONSTITUTION: A support wafer (310) supports a temperature measuring unit (320a-320c) and a first insulation part (330). The temperature measuring unit is arranged in a groove formed on the support wafer. The groove includes an inner side which is inclined to the upper side of the support wafer. The width of the groove becomes smaller from the bottom to the inlet of the groove. A second insulation part (340) surrounds a first metal wire and a second metal wire. A terminal part (350) is connected to the first metal wire and the second metal wire.