| 摘要 |
PURPOSE: A manufacturing method of a circuit pattern has enough binding force between the circuit pattern and a ground material by forming a three dimensional figure circuit pattern or a curved circuit pattern on the ground material. CONSTITUTION: A first pattern is formed on a ground material (40) by performing a patterning process to a protective layer (41). A concave groove domain (41a) is formed inside the first pattern. Polymer paint is coated on the ground material within the concave groove domain. An activated metal layer having a circuit pattern is formed. The activated metal layer exposed to the surface of the ground material. |
