发明名称 |
METHOD FOR MANUFACTURING SEALING RESIN SHEET |
摘要 |
In order to manufacture a sealing resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate at low cost and suppress mixing of air bubbles into the sealing resin sheet, in the first step, a resin body (22) in a semi-cured state is disposed in a space (26) surrounded by a pair of pressing plates (23, 25) facing each other and a side plate (24) provided on the outer peripheral side. In the second step, a vacuum is drawn into the space (26), and the resin body (22) is heated at a temperature lower than a curing temperature and extended by being pressed at a pressing speed of 0.004-0.06 mm/sec (inclusive) by the pressing plates (23, 25). Consequently, a sealing resin sheet (11) is produced. |
申请公布号 |
WO2013129307(A1) |
申请公布日期 |
2013.09.06 |
申请号 |
WO2013JP54749 |
申请日期 |
2013.02.25 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KATSUBE, AKIO;KITAYAMA, HIROKI;IDA, YUYA;WATANABE, KOJI |
分类号 |
H01L21/56;B29B11/12 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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