| 摘要 |
PROBLEM TO BE SOLVED: To stabilize operations of switching mode circuits including a digital circuit, and to reduce electromagnetic interference at the inside and the outside of the switching mode circuit.SOLUTION: A second assembly is formed by conductively adhering a transmission line structure chip, which is formed by cutting a multilayer structure body configured by an aluminum layer, an etching layer, a resist layer, a conductive polymer layer formed in the etching layer, a carbon-containing layer, and a metal powder coating layer into a rectangle shape, to an inner surface of a shaped anode conductor foil, and by adhering a frame-shaped first insulation adhesive sheet to the periphery of the chip. On a plane consisting of the transmission line structure chip and the first insulation adhesive sheet of the second assembly, a rectangular second insulation adhesive sheet having two connection holes are adhered. A cathode conductor foil is conductively adhered to the transmission line structure chip of the second assembly via the connection holes of the second insulation adhesive sheet to form a power supply decoupling component. The power supply decoupling component is used by being inserted into the vicinity of a semiconductor integrated circuit of a power line. |
