| 摘要 |
A method for producing perforated work pieces from glass, glass ceramics, or semiconductors in a stress-relieving manner is provided. The method includes heating the work piece up to the glass transition temperature and perforating the work piece using a high-voltage electric field of suitable frequency or pulse shape. Then, the perforated work piece is allowed to cool down from the transition temperature range to room temperature at a rate at which the mechanical stresses generated by the perforation process relax. |
