| 摘要 |
A method for manufacturing a cover plate and a method for manufacturing an encapsulated LED using the cover plate are disclosed. The cover plate is manufactured by the following steps: mixing uncured acryl and fluorescent powder, defoaming, inject-molding and curing. The cover plate can be used for manufacturing an encapsulated LED, which can avoid or minimize the fluorescent powder being heated or being eroded by moisture, and can keep stability of the fluorescent powder, thereby increasing service life of the encapsulated LED.
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