发明名称 STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic component and printed wiring board including a structure body excellent in joint strength and corrosion resistance and free from a noble metal such as palladium.SOLUTION: A structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer. The intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.
申请公布号 JP2013174007(A) 申请公布日期 2013.09.05
申请号 JP20120250620 申请日期 2012.11.14
申请人 TDK CORP 发明人 ORIGASA MAKOTO;SEIKE HIDEYUKI;ITO NOBORU;YOSHIDA KENICHI;HORIKAWA YUHEI
分类号 C23C28/02;C23C18/32;C23C18/50;H01F27/29;H01G4/232;H01G4/252;H01G4/30;H05K1/09 主分类号 C23C28/02
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