| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a film which forms a film in a film formation surface having a level difference by using a droplet discharge method, and which hardly generates cracks or the like in the film at a subsequent drying/firing process.SOLUTION: By using a droplet discharge device, a precursor solution containing at least metal powder or ceramic powder, an organic binder, and a solvent is discharged as a plurality of droplets in a film formation surface having a level difference, and thus a film is formed in a film formation region of the film formation surface. Cracks or the like are not easily generated in the film at a drying/firing process when the relation of &Dgr;t≤0.15h is satisfied in the case of satisfying the relation of tmin>(2/3) h, wherein h is the height of the level difference, &Dgr;t is the difference between the maximum value and the minimum value of the film thickness in the state after drying of the film, and tmin is the minimum value of the film thickness in the state after drying of the film. |
