| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus which can improve the use efficiency of slurry.SOLUTION: A polishing apparatus comprises: a machine platen 10 arranged with a polishing pad 12 at its upper face and rotatably driven; a substrate moving mechanism 30 for relatively moving a substrate W to the machine platen 10; and a slurry supply device for supplying slurry to the polishing pad by a nozzle 63, and performs polishing processing while supplying the slurry. The polishing apparatus also comprises a slurry receiving groove 110 for receiving the slurry poured out of the polishing pad 12, and a liquid sending pump 150 for making the slurry received by the slurry receiving groove 110 flow out to the center of the upper face of the polishing pad 12 via a slurry collecting passage 130 and a slurry supply passage 120. The polishing apparatus is constituted so that the slurry may circulate in the machine platen 10 during the polishing processing of the substrate W. |
