ELECTROSTATIC CHUCK SUCKING AND HOLDING WAFER

摘要

PROBLEM TO BE SOLVED: To provide an electrostatic chuck that reliably sucks and holds a wafer.SOLUTION: An electrostatic chuck 1410 that electrostatically sucks and holds a wafer is formed by laminating a substrate 1405, an electrode plate 1412 having a first electrode plate 1401 and a second electrode plate 1402, and an insulating layer 1404. The electrode plate of the electrostatic chuck is applied with a voltage that changes in conjunction with an increase or a decrease of a voltage applied to the wafer over time from 0 volt to a predetermined voltage, and thereby suction force is generated between the wafer and the chuck.