| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a lead frame which prevents a sealing resin from flowing into a space between a rear surface of an element mounting part and a mold and causing thin burrs when the sealing resin is poured thereby achieving high heat radiation effect and is used for a pad type or heat sink type semiconductor device.SOLUTION: In a manufacturing method of a lead frame 18 which is used for a pad type or heat sink type semiconductor device 10 where an element mounting part 12, on which a semiconductor chip 11 is placed, is exposed from a rear surface of the sealing resin 13, a protruding wall 14, which prevents the occurence of thin burrs during resin sealing, is provided around an exposed surface of the exposed element mounting part 12. |
