| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition for a semiconductor package having good molding processability such as transfer moldability and having light resistance and heat resistance.SOLUTION: A white or black light-emitting diode package 1 contains, as essential components, (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with an SiH group in one molecule, (B) a compound containing at least two SiH groups in one molecule, (C) a hydrosilylated catalyst and (D) an inorganic filler; is obtained by forming a curable resin composition where the addition amount of the inorganic filler is 46 to 95 wt.% or more in the whole composition; and has a recess or a flat plate shape to mount a light-emitting diode element 2. In the light-emitting diode package 1, the light emission output of the light-emitting diode is 5 mW or more at 20 mA and a lead terminal material 4 consisting of iron, copper, iron-containing copper, tin-containing copper, or each plated with gold, silver, nickel or palladium is used. |
