发明名称 |
LED DEVICE WITH IMPROVED THERMAL PERFORMANCE |
摘要 |
An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.
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申请公布号 |
US2013230935(A1) |
申请公布日期 |
2013.09.05 |
申请号 |
US201313858785 |
申请日期 |
2013.04.08 |
申请人 |
TSMC SOLID STATE LIGHTING LTD. |
发明人 |
HSIA HSING-KUO;YU CHIH-KUANG;KUO GORDON;CHEM CHYI SHYUAN |
分类号 |
H01L33/64 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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