发明名称 INTERCONNECTION STRUCTURE
摘要 Provided is an interconnection structure that, in a display device such as an organic EL display or a liquid crystal display, has superior workability during wet etching even without providing an etch stop layer. The interconnection structure has, in the given order, a substrate, a semiconductor layer of a thin film transistor, and a metal interconnection film, and has a barrier layer between the semiconductor layer and the metal interconnection film. The semiconductor layer comprises an oxide semiconductor, the barrier layer has a layered structure of a high-melting-point metal thin film and a Si thin film, and the Si thin film is directly connected to the semiconductor layer.
申请公布号 US2013228926(A1) 申请公布日期 2013.09.05
申请号 US201113882635 申请日期 2011.10.11
申请人 MAEDA TAKEAKI;KUGIMIYA TOSHIHIRO;KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) 发明人 MAEDA TAKEAKI;KUGIMIYA TOSHIHIRO
分类号 H01L23/532 主分类号 H01L23/532
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