发明名称 SEMICONDUCTOR DEVICE HAVING A STRAINED REGION
摘要 The present disclosure provides devices and methods which provide for strained epitaxial regions. A method of semiconductor fabrication is provided that includes forming a gate structure over a fin of a semiconductor substrate and forming a recess in the fin adjacent the gate structure. A sidewall of the recess is then altered. Exemplary alterations include having an altered profile, treating the sidewall, and forming a layer on the sidewall. An epitaxial region is then grown in the recess. The epitaxial region interfaces the altered sidewall of the recess and is a strained epitaxial region.
申请公布号 US2013228862(A1) 申请公布日期 2013.09.05
申请号 US201213411214 申请日期 2012.03.02
申请人 LEE TSUNG-LIN;YUAN FENG;CHIANG HUNG-LI;YEH CHIH CHIEH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,("TSMC") 发明人 LEE TSUNG-LIN;YUAN FENG;CHIANG HUNG-LI;YEH CHIH CHIEH
分类号 H01L27/12;H01L21/20;H01L21/336 主分类号 H01L27/12
代理机构 代理人
主权项
地址