SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be manufactured by a simple process at low cost.SOLUTION: A semiconductor device comprises: a lead frame 100 having a plurality of lead terminals; a semiconductor element 1 that is fixed on a principal surface 100a of the lead frame 100; a control substrate 3 controlling the semiconductor element 1, which is arranged distant from the principal surface 100a of the lead frame 100 and has a plurality of bonding pads; a plurality of metal wires 5 that connect the bonding pads of the control substrate 3 and the lead terminals of the lead frame 100; and a mold resin 6 that integrally seals them. The control substrate 3 and the lead frame 100 are connected only by the metal wires 5.