发明名称 CERAMIC ELECTRONIC COMPONENT MANUFACTURING METHOD AND CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component manufacturing method, with which it is easy to peel a resist from a conductor pattern (or an insulator pattern) and it is possible to reliably form a conductor pattern or an insulator pattern that is minute, is high in accuracy, and has a high aspect ratio, and a ceramic electronic component having a favorable characteristic that is manufactured with the method.SOLUTION: A ceramic electronic component manufacturing method includes the steps of: forming a resist pattern using a photoresist; applying a photosensitive conductor paste (or a photosensitive insulator paste) of negative type to an area, in which the photoresist is removed and which corresponds to a conductor pattern (or an insulator pattern), of the resist pattern and curing the photosensitive conductor paste (or the photosensitive insulator paste) through exposure; and forming the conductor pattern (or the insulator pattern) on a base material by removing the resist pattern. A photoresist of positive type is used as the photoresist.
申请公布号 JP2013175505(A) 申请公布日期 2013.09.05
申请号 JP20120037563 申请日期 2012.02.23
申请人 MURATA MFG CO LTD 发明人 KANBARA HIROYUKI
分类号 H01F41/04;H01F17/00;H01G4/12;H01G4/30 主分类号 H01F41/04
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