| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for polishing a double-side mirror polished silicon wafer, which realizes a high-quality surface morphology on the silicon wafer, thereby enabling further miniaturization of an electronic circuit.SOLUTION: In a method for polishing a double-side mirror polished silicon wafer, a three-stage polishing method is employed for polishing a silicon wafer. In the method, polishing conditions are changed for each stage and a double-side polisher is used. Furthermore, the three-stage polishing is performed as a first stage polishing using a sun gear style double side polishing, and as a second stage polishing and a finish stage polishing using a sun gear free style double side polishing in which the polishing is performed in a plane parallel to the surface of a carrier plate, the carrier plate moves in a circular motion without rotating. Thus, a high-quality surface morphology on the silicon wafer is realized, thereby enabling a further miniaturization of an electronic circuit. |
