CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BOND

摘要

PURPOSE: A capillary replacing system in a semiconductor wire bonding process is provided to reduce capillary replacement costs and time by automatically replacing a capillary used in the semiconductor wire bonding process. CONSTITUTION: A wire bonding unit includes a chuck with a chucking unit (116) with which a capillary is engaged. A chucking release induction unit (110) is accurately arranged to apply a mechanical force to the chuck. The chucking release induction unit is operated to release the capillary from the chucking unit. The chucking release induction unit includes an extension diameter tool (111) which is inserted into an insertion unit and extends the chucking unit. A capillary replacement unit mounts a new capillary on the chuck after the capillary is separated from the chuck of the wire bonding unit.