SUPPORTER MANUFACTURING METHOD OF JIG FOR SEMICONDUCTOR

摘要

PURPOSE: A manufacturing method of a supporter for a semiconductor device fixing jig is provided to enable a mass production from being possible by processing a part in which a precision degree of a size is required with a wire cut electric spark process after a molded object including the shape of the supporter is manufactured. CONSTITUTION: A manufacturing method of a supporter for a semiconductor device fixing jig comprises as follows. A molded object (100) is manufactured with powder metallurgy corresponding to the shape of the supporter (S100). A part in which a precision degree of a size is required is processed in wire cut electric processing on the molded object manufactured through a powder metallurgy molding process (S200). [Reference numerals] (AA) Start; (BB) End; (S110) Mixing step; (S120) Compressing step; (S130) Sintering step; (S140) Correcting step; (S200) Wire cut electric discharge processing step