发明名称 METHOD FOR PRODUCING SOLDER PASTE, AND THE SOLDER PASTE PRODUCED BY THE SAME
摘要 PROBLEM TO BE SOLVED: To stabilize the viscosity of solder paste without causing an increase in the viscosity of the solder paste by suppressing the growth of metal salt even under the long-term storage of the solder paste, thereby improving the storage stability of the solder paste while maintaining excellent solder melting property.SOLUTION: Solder paste 10 is produced by mixing a first flux 11 containing a solvent, rosin and a thixotropic agent, into solder powder 13 to prepare a mixture 14, and further mixing a second flux 12 into the mixture 14. The second flux 12 contains an activator containing one or more kinds selected out of a group consisting of organic acid-based, amine and organic halogen compounds and ionic halogen compounds; a solvent; and rosin. The first flux 11 does not contain the activator.
申请公布号 JP2013173156(A) 申请公布日期 2013.09.05
申请号 JP20120038501 申请日期 2012.02.24
申请人 MITSUBISHI MATERIALS CORP 发明人 UESUGI RYUJI
分类号 B23K35/40;B23K35/22;B23K35/26;B23K35/363;C22C13/00;H05K3/34 主分类号 B23K35/40
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