| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device having a semiconductor lamination unit, and to provide a technology for detachably connecting between a terminal of a laminated semiconductor module and a bus bar in a small space.SOLUTION: A semiconductor lamination unit 3 is obtained by alternately laminating a plurality of semiconductor modules 5 and cooling plates 4. From each semiconductor module, a flat-plate terminal 6a is extended in parallel. The terminal 6a and a bus bar 7 are held by a clip 20. The clip 20 is configured by an U-shape part 21 holding the terminal 6a and the bus bar 7, and an intersection part 23 extending from the respective arms of the U-shape part. With respect to the clip 20, when two front ends of the intersection part are at such positions that approach each other, an inner width of the U-shape part is expanded to loosely fit front ends of the terminal 6a and of the bus bar 7 therein. When the two front ends are at positions separated from each other, the inner width of the U-shape part is narrowed to clip and hold the front ends of the terminal 6a and the bus bar 7. By adopting the clip 20, the terminal 6a and the bus bar 7 are detachable in a small space. |
