发明名称 COOLING SYSTEM, SUBSTRATE PROCESSING APPARATUS INCLUDING COOLING SYSTEM, AND COOLING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a cooling system and a cooling method which control a coolant temperature with a simple structure.SOLUTION: A cooling system 90 comprises: a vaporization vessel 80; a first fluid source 92; a first flow control system 91; and a pressure control system 99. In the vaporization vessel 80, a space is defined therein and a supply port, from which a coolant is supplied, and a discharge port, from which the coolant is discharged, are provided. The first fluid source 92 stores a first fluid having a vapor pressure higher than that of the coolant. The first flow control system 91 connects the first fluid source with the vaporization vessel and controls a supply amount of the first fluid to the vaporization vessel. The pressure control system 99 controls the pressure in the vaporization vessel so that the pressure lies in a range that is higher than the vapor pressure of the coolant and is equivalent to or lower than the vapor pressure of the first fluid.
申请公布号 JP2013175514(A) 申请公布日期 2013.09.05
申请号 JP20120037770 申请日期 2012.02.23
申请人 TOKYO ELECTRON LTD 发明人 SASAKI YASUHARU
分类号 H01L21/3065 主分类号 H01L21/3065
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