| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition sufficiently low in all of dielectric constant, dielectric loss tangent and coefficient of thermal expansion, particularly, a resin composition having a sufficiently small dielectric constant and a low dielectric loss tangent, and a sufficiently low coefficient of thermal expansion at 150°C or higher.SOLUTION: A resin composition includes: an epoxy resin, a curing agent, hollow silica and fused silica. |
