| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element electrode bonding method which can increase bondability at a bonding part between a lead frame and a semiconductor element when bonding a metallic lead frame to a semiconductor electrode arranged on a semiconductor element.SOLUTION: A bonding method of a semiconductor element electrode 3 of bonding a metallic lead frame 2 to the semiconductor element electrode 3 arranged on a semiconductor element 1 comprises: immersing the lead frame 2 and the semiconductor element electrode 3 into a plating solution with maintaining the lead frame 2 and the semiconductor element electrode 3 in an attitude to be bonded; and bonding the lead frame 2 to the semiconductor element electrode 3 by metal obtained by deposition of the metal contained in the plating solution. |
