发明名称 Temperature-Controlled Enclosures And Temperature Control System Using The Same
摘要 A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
申请公布号 US2013231040(A1) 申请公布日期 2013.09.05
申请号 US201313854678 申请日期 2013.04.01
申请人 TEMPTRONICS CORPORATION 发明人 COLE, SR. KENNETH M.;CONROY MICHAEL F.;LOWERRE EDWARD;PELRIN JAMES
分类号 F25D23/06 主分类号 F25D23/06
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