发明名称 |
Temperature-Controlled Enclosures And Temperature Control System Using The Same |
摘要 |
A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.
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申请公布号 |
US2013231040(A1) |
申请公布日期 |
2013.09.05 |
申请号 |
US201313854678 |
申请日期 |
2013.04.01 |
申请人 |
TEMPTRONICS CORPORATION |
发明人 |
COLE, SR. KENNETH M.;CONROY MICHAEL F.;LOWERRE EDWARD;PELRIN JAMES |
分类号 |
F25D23/06 |
主分类号 |
F25D23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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