| 摘要 |
The present invention provides a method for continuously producing flexible copper clad laminates, which comprises a step of performing continuous copper plating after the steps or step of performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method provided by the present invention is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns. In addition, more importantly, in the method provided by the present invention for continuously producing the two-layer flexible copper clad laminates, not only one surface of the film substrate, but also the two surfaces of the film substrate can be simultaneously treated, so the production efficiency is high.
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