发明名称 |
PACKAGE, PACKAGE ASSEMBLY, AND PACKAGING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a package capable of suppressing breakage of a fragile thin board.SOLUTION: A package includes lamination bodies 5 including a plurality of fragile thin boards, lamination body holding materials 6 holding the lamination bodies 5, and a packaging container including at least a body 4 having a plurality of recesses 41. The lamination bodies 5 are fitted in the recesses 41 together with the lamination body holding materials 6 while surfaces formed in a lamination direction of the lamination bodies 5 face the bottom surfaces of the recesses 41. |
申请公布号 |
JP2013173565(A) |
申请公布日期 |
2013.09.05 |
申请号 |
JP20120230203 |
申请日期 |
2012.10.17 |
申请人 |
KYORITSU ELEX CO LTD;NIPPON SHOKUBAI CO LTD |
发明人 |
TAKAGI YUTAKA;NISHIYAMA KENGO;SAKAMOTO KATSUHIKO;HATA KAZUO |
分类号 |
B65D85/44;B65D57/00;B65D77/26;B65D85/00 |
主分类号 |
B65D85/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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