发明名称 PACKAGE, PACKAGE ASSEMBLY, AND PACKAGING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a package capable of suppressing breakage of a fragile thin board.SOLUTION: A package includes lamination bodies 5 including a plurality of fragile thin boards, lamination body holding materials 6 holding the lamination bodies 5, and a packaging container including at least a body 4 having a plurality of recesses 41. The lamination bodies 5 are fitted in the recesses 41 together with the lamination body holding materials 6 while surfaces formed in a lamination direction of the lamination bodies 5 face the bottom surfaces of the recesses 41.
申请公布号 JP2013173565(A) 申请公布日期 2013.09.05
申请号 JP20120230203 申请日期 2012.10.17
申请人 KYORITSU ELEX CO LTD;NIPPON SHOKUBAI CO LTD 发明人 TAKAGI YUTAKA;NISHIYAMA KENGO;SAKAMOTO KATSUHIKO;HATA KAZUO
分类号 B65D85/44;B65D57/00;B65D77/26;B65D85/00 主分类号 B65D85/44
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