| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device which enables a process where high temperature is generated for joining a light emitting element to a substrate to be used while using an inexpensive resin substrate in the manufacturing and makes the degradation and the deterioration of the luminous efficiency less likely to be caused by the usage.SOLUTION: A light emitting device which includes: a silicon resin based substrate 11; a conductor part 13 formed on the substrate; a light emitting element 17 disposed on the conductor part through a metal joining material 18; and a peripheral wall body 21 joined onto the substrate through an adhesive material 21A and enclosing the light emitting element. The conductor part is disposed so as to be separated from the adhesive material. |
