| 摘要 |
PROBLEM TO BE SOLVED: To resolve problems that, in a conventional device, because switching elements are not on the same substrate and are individually arranged in an inverter case, and therefore, wiring by a bus bar or resin integral molding or the like is required for connection between the switching elements and connection between each switching element and a control circuit, a flow channel configuration for cooling medium is complicated, which is likely to cause generation of pressure loss, and that cooling property of components provided on the downstream side of the cooling medium is deteriorated compared with an upstream side by reduction in flow rate.SOLUTION: A mechatronic integrated drive device comprises: a housing integrally covering an electric motor and an inverter device, and provided with a heat radiation fin at a part covering the electric motor; an inverter substrate whose one plane is attached to the housing by an electrical insulation adhesive agent, and to whose other plane switching elements of the inverter are mounted; and a heat transfer body buried in this inverter substrate so as to intervene between the switching elements and the housing, and transferring heat generated by the switching elements to the housing. |
