| 摘要 |
A light-emitting device assembly includes a plurality of light-emitting devices. The plurality of light-emitting devices each includes a circuit board including a pair of electrodes to be connected to an external power source, and to which an electric power is supplied from the power source through the electrodes; a semiconductor element supported on and electrically connected to the circuit board; and an encapsulating layer that encapsulates the semiconductor element on the circuit board. The plurality of light-emitting devices are disposed so as to be continuous in one direction. The encapsulating layer is disposed so that the encapsulating layers of the light-emitting devices next to each other are in contact with each other when viewed from the top.
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