| 摘要 |
<p>A housing (1) for an optoelectronic component (10) is specified, wherein the housing (1) has a mounting face, intended for mounting the housing, a first supply lead (31), a second supply lead (32) and a housing body (2). The housing body (2) has a connecting region (21) and a surface region (22). The connecting region mechanically connects the first supply lead and the second supply lead to one another. The surface region covers at least regions of the connecting region on the side which is remote from the mounting face. The connecting region and the surface region are different from one another in terms of the material. In addition, a method for producing a housing (1) is specified.</p> |
